TC55VBM316AFTN

Features: • Low-power dissipation Operating: 9 mW/MHz (typical)• Single power supply voltage of 2.3 to 3.6 V• Power down features usingCE1 and CE2• Data retention supply voltage of 1.5 to 3.6 V• Direct TTL compatibility for all inputs and outputs• Wide operating...

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SeekIC No. : 004514147 Detail

TC55VBM316AFTN: Features: • Low-power dissipation Operating: 9 mW/MHz (typical)• Single power supply voltage of 2.3 to 3.6 V• Power down features usingCE1 and CE2• Data retention supply volt...

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Part Number:
TC55VBM316AFTN
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2025/1/12

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Product Details

Description



Features:

• Low-power dissipation Operating: 9 mW/MHz (typical)
• Single power supply voltage of 2.3 to 3.6 V
• Power down features usingCE1 and CE2
• Data retention supply voltage of 1.5 to 3.6 V
• Direct TTL compatibility for all inputs and outputs
• Wide operating temperature range of −40° to 85°C
• Standby Current (maximum):
3.6V 15 A
3.0 V 8 A




Pinout

  Connection Diagram


Specifications

SYMBOL RATING VALUE UNIT
VDD Power Supply Voltage −0.3~4.2 V
VIN Input Voltage −0.3*~4.2 V
VI/O Input/Output Voltage −0.5~VDD + 0.5 V
PD Power Dissipation 0.6 W
Tsolder Soldering Temperature (10s) 260
Tstg Storage Temperature −55~150
Topr Operating Temperature −40~85

*: −2.0 V when measured at a pulse width of 20ns




Description

The TC55VBM316AFTN/ASTN is a 8,388,608-bit static random access memory (SRAM) organized as 524,288 words by 16 bits/1,048,576 words by 8 bits. Fabricated using Toshiba's CMOS Silicon gate process technology, this device operates from a single 2.3 to 3.6 V power supply. Advanced circuit technology provides both high speed and low power at an operating current of 3 mA/MHz and a minimum cycle time of 40 ns. TC55VBM316AFTN is automatically placed in low-power mode at 0.7 A standby current (at VDD = 3 V, Ta = 25°C, typical) when chip enable (CE1 ) is asserted high or (CE2) is asserted low. There are three control inputs. CE1 and CE2 are used to select the device and for data retention control, and output enable (OE ) provides fast memory access. Data byte control pin (LB , UB ) provides lower and upper byte access. This device is well suited to various microprocessor system applications where high speed, low power and battery backup are required. And, with a guaranteed operating extreme temperature range of −40° to 85°C, the TC55VBM316AFTN/ASTN can be used in environments exhibiting extreme temperature conditions. The TC55VBM316AFTN/ASTN is available in a plastic 48-pin thin-small-outline package (TSOP).




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