TC43

Supply Voltage ..............................................................6V
Package Power Dissipation (T_A  70)
     PDIP ..................................................................840mW
    SOIC (Narrow) ...................................................700mW
Voltage on Any Pin:
    (With Respect to GND) ...... (V_SS 0.3V) to (V_DD +0.3V)
Operating Temperature Range:
    C Suffix ...................................................... 0 to +70
    E Suffix ............................................... 40 to + 85
Storage Temperature Range ................. 65 to +150
Lead Temperature (Soldering, 10 sec) ................... +300

* Static-sensitive device. Unused devices must be stored in conductive material. Protect devices from static discharge and static fields. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to Absolute Maximum Rating Conditions for extended periods may affect device reliability.

The TC43 is a mixed-function device combining two general purpose op amps, two general purpose comparators and a voltage reference in a single 16-pin package.

This increased integration allows the user to replace two or three packages, saving space, lowering supply current, and increasing system performance. A Shutdown input, SHDN, disables the op amps and one of the comparators, placing their outputs in a high-impedance state. The reference and one comparator stay active in Shutdown
Mode. Standby power consumption is typically 5mA.

The TC43 is designed specifically for operation from a single supply, however, operation from dual supplies is also possible, and the power supply current drain is independent of the magnitude of the power supply voltage.

Packaged in a 16-pin narrow SOIC (0.150 wide) or 16-pin DIP, the TC43 is ideal for applications requiring high integration, small size and low power.