Features: · High intensity with small package, ideal for backlighting· Wide viewing angle ( 120° )· Package Outline (L×W×H)=5.0×5.0×1.5 mm· Technology : InGaN· Color coordinates CIE(x,y) : (0.31,0.31) according to CIE 1931.· Suitable for all SMT assembly methods· Suitable for all soldering methods...
T5050: Features: · High intensity with small package, ideal for backlighting· Wide viewing angle ( 120° )· Package Outline (L×W×H)=5.0×5.0×1.5 mm· Technology : InGaN· Color coordinates CIE(x,y) : (0.31,0.3...
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Item |
Symbol |
Rating |
Unit |
Reverse Voltage |
VR |
5 |
V |
Forward Current |
IF |
40 |
mA |
Operating Temperature |
Topr |
-30 ~ +85 |
|
Storage Temperature |
Tstg |
-40 ~ +100 |
|
Soldering Temperature |
Tsol |
260 (for 5 sec) |
|
Power Dissipation |
PD |
432 (3 chips ON) |
mW |
Peak Forward Current (Duty 1/10 @ 1KHz) |
IF(peak) |
240 (3 chips ON) |
mA |
Junction temperature |
Tj |
110 |
|
Thermal Resistance |
Rth,JA |
450 |
/W |