T492

`Handling
 Automatic handling of encapsulated components
is enhanced by the molded case which provides compatibility with all types of high speed pick and place equipment. Manual handling of these devices presents no unique problems. Careshould be taken with your fingers, however, to avoid touching the solder-coated terminations as body oils, acids and salts will degrade the solderability of these terminations. Finger cots should be used whenever manually handling all solderable surfaces.

` Termination Coating
  KEMET's standard termination finish is 100% Sn (Excluding the T492/3 series. Refer to specific lead frame options available on T493 Series).

  Standard terminations can be ordered with a "T" suffix in the lead material designator of the KEMET part number. Components ordered with the "T" suffix are Pb-Free/RoHS compliant and are backward and forward compatible with SnPb ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 and Pb-Free soldering processes.

  90Sn/10Pb terminations are also available and can be ordered with an "H" suffix.

  KEMET's "S" suffix remains an active termination designator for current designs but is not recommended for new designs. Parts ordered with an   "S" suffix are not guaranteed to be Pb-Free or RoHS compliant. Refer to www.kemet.com for information on Pb-Free transition.

  For conductive adhesive attachment processes, a gold termination finish is available for most series and case sizes. Refer to the specific series for details.

`Recommended Mounting Pad Geometries Proper mounting pad geometries are essential for successful solder connections. These dimensions are highly process sensitive and should be designed to maximize the integrity of the solder joint, and to minimize component rework due to nacceptable solder joints.

  Figure 12 illustrates pad geometry. Tables 9 & 10 provide recommended pad dimensions for both wave and reflow soldering techniques.

  These dimensions are intended to be a starting point for circuit board designers, to be fine tuned, if necessary, based upon the peculiaritiesof the soldering process and/or circuit board design.

  Contact KEMET for Engineering Bulletin Number F-2100 entitled "Surface Mount Mounting Pad Dimensions and Considerations" for further details on this subject.

` Soldering
  KEMET's families of surface mount tantalum capacitors are compatible with wave (single or dual) soldering and IR or vapor phase reflow echniques. Solder-coated terminations have excellent wetting characteristics for high integrity solder fillets. Preheating of these components is recommended to avoid extreme thermal stress. Figure 13 represents recommended maximum solder temperature / time combinations for thesedevices.

  Note that although the X/7343-43 case size can withstand wave soldering, the tall profile (4.3mm maximum) dictates care in wave process development.

  Hand-soldering should be performed with care due to the difficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflow occurs. The iron should be removed.

  "Wiping" the edges of a chip and heating the top surface is not recommended.

  During typical reflow operations a slight darkening of the gold-colored epoxy may be observed.

  This slight darkening is normal and is not harmful to the product. Marking permanency is not affected by this change.

` Washing
  Standard washing techniques and solvents are compatible with all KEMET surface mount tantalum capacitors. Solvents such as Freon TMC and TMS, Trichlorethane, methylene chloride, prelete, and isopropyl alcohol are not harmful to these components.

  If ultrasonic agitation is utilized in the cleaningprocess, care should be taken to minimize energy levels and exposure times to avoid damage to the terminations.

  KEMET tantalum chips are also compatible with newer aqueous and semi-aqueous processes. Please follow the recommendations for cleaning as defined by the solder vendor.

` Encapsulations
  Under normal circumstances, potting or encapsulation  of KEMET tantalum chips is not required. ` Storage Environment Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature reels may soften or warp, and tape peel force may increase. KEMET recommends that maximum storage temperature.

  not exceed 40 degrees C, and maximum storage humidity not exceed 60% relative humidity. In addition, temperature fluctuations should be minimized to avoid condensation on the parts, and atmospheres should be free of chlorine and  sulfur bearing compounds. For optimized solderability, chip stock should be used promptly, preferably within 3 years of receipt. 

KEMET's family of solid tantalum chip capacitors is designed and manufactured with the demanding  requirements of surface mount technology in mind.

These devices extend the advantages of solid tantalum technology to today's surface mount circuit applications. Complementing multilayer ceramic chip convenience with capacitance ratings through 1500 F, tantalum chip capacitors permit circuitdesigners to take full advantage of the benefits of surface mount technology.

T491 Series - Industrial
The leading choice in today's surface mount designs is the KEMET T491 Series. This product meets or exceeds the requirements of EIA standard 535BAAC. The physical outline and dimensions of this series conform to this global standard.

Five low profile case sizes are available in the T491 family. The R/2012-12, S/3216-12 and T/3528-12
case sizes have a maximum height of 1.2 mm. The U/6032-15 size has a maximum height of 1.5 mm, and the V/7343-20 has a maximum height of 2.0 mm.

This product was designed specifically for today's highly automated surface mount processes and equipment. This series uses the same proven solid tantalum KEMET technology acclaimed and respected throughout the world. Added to this is the latest in materials, processes and automation which result in a component unsurpassed worldwide in total performance and value.

The standard terminations are 100% matte tin and provide excellent wetting characteristics and compatibility with today's surface mount solder systems. Tin-Lead (SnPb) terminations are available upon request for any part number. Gold-plated terminations are also available for use with conductive epoxy attachment processes. The symmetrical terminations offer total compliancy to provide the thermal and mechanical stress relief required in today's technology. Lead frame attachments to the tantalum pellet are made via a microprocessorcontrolled welding operation, and a high temperature silver epoxy adhesive system.

Standard packaging of these devices is tape and reel in accordance with EIA 481-1. This system provid es perfect compatibility with all tape-fed placement units.

T492 Series - Military
KEMET is approved to MIL-PRF-55365/8 (CWR11), Weibull failure rate "B" level or 0.1% failures per 1,000 hours, "C" level or 0.01% failures per 1,000 hours, and "D" level or 0.001% failures per 1,000 hours. This CWR11 product - designated as KEMET's T492 Series - is a precision-molded device, with compliant leadframe terminations and indelible laser marking. This is the military version of the global IEC/EIA standard represented by KEMET's T491 Series. Tape and reeling per EIA T493 Series - Military - COTS

The T493 series is designed for the COTS
(Commercial-Off-The-Shelf) requirements of military/aerospace applications. This series is a surface mount tantalum product offering various leadframe surface finishes, Weibull grading and surge current testing options. The full part number includes a code defining the terminations, the Weibull reliability, surge test conditions, and the ESR range. The possible terminations include gold plated, hot solder dipped, solder plated, and solder fused. Reliability grading of B level (0.1%/kHours) and C level (0.01%/kHours) are available. Surge current testing options include: 10 cycles at 25ºC, or 10-cycles at -55ºC and +85ºC. Both standard and low ESR options are available. All lots of this series are conditioned with MIL-PRF-55365 Group A testing.

T494 Series - Low ESR, Industrial Grade
The T494 is a low ESR series that is available in all the same case sizes and CV ratings as the popular T491 series. The T494 offers low ESR performance with the economy of an industrial grade device. This series is targeted for output filtering and other applications that may benefit from improved efficiency due to low ESR.

T495 Series - Low ESR, Surge Robust
The low ESR, surge robust T495 series is an important member of KEMET's tantalum chip family. Designed primarily for output filtering in switch-mode power supplies and DC-to-DC converters, the standard CV T495 values are also an excellent choice for batteryto- ground input filter applications.

This series builds upon proven technology used for industrial grade tantalum chip capacitors to offer several important advantages: very low ESR, high ripple current capability, excellent capacitance stability, plus improved ability to withstand high inrush currents. These benefits are achieved through a combination of proprietary design, material, and process parameters, as well as high-stress, low impedance electrical conditioning performed prior to screening. Capacitance values range from 4.7F to 1000F, in voltage ratings from 2.5 to 50 volts.

T496 Series - Fused
KEMET also offers a "fail-safe" fused solid tantalum chip capacitor. The built-in fuse element provides excellent protection from damaging short circuit conditions in applications where high fault currents exist. Protection from costly circuit damage due to reversed installation is offered with this device. Package sizes include the EIA standard 3528-12, 6032-15, 7343-31, and 7343-43 case size. Capacitance values range from 0.15 F to 470.0 F, in voltage ratings from 4 to 50. Standard capacitance tolerances include ±20% and ±10%. Tape and reeling per EIA 481-1 is standard.