Features: Avalanche Rugged TechnologyRugged Gate Oxide TechnologyLower Input CapacitanceImproved Gate ChargeExtended Safe Operating AreaLower Leakage Current : 25 mA (Max.) @ VDS = 600VLow RDS(ON) : 9.390 W (Typ.)Specifications Symbol Characteristic Value Units VDSS Drain-to-Source Vol...
SSI1N60A: Features: Avalanche Rugged TechnologyRugged Gate Oxide TechnologyLower Input CapacitanceImproved Gate ChargeExtended Safe Operating AreaLower Leakage Current : 25 mA (Max.) @ VDS = 600VLow RDS(ON) :...
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Symbol | Characteristic | Value | Units |
VDSS | Drain-to-Source Voltage | 600 | V |
ID | Continuous Drain Current (TC=25 ) | 1 | A |
Continuous Drain Current (TC=100 ) | 0.6 | ||
IDM | Drain Current-Pulsed | 3 | A |
VGS | Gate-to-Source Voltage | ±30 | V |
EAS | Single Pulsed Avalanche Energy | 44 | mJ |
IAR | Avalanche Current | 1 | A |
EAR | Repetitive Avalanche Energy | 3.4 | mJ |
dv/dt | Peak Diode Recovery dv/dt | 3.0 | V/ns |
PD | Total Power Dissipation (TA=25) | 3.1 | W |
Total Power Dissipation (TC=25 ) Linear Derating Factor |
34 0.27 |
W W/ | |
TJ , TSTG | Operating Junction and Storage Temperature Range |
- 55 to +150 | |
TL | Maximum Lead Temp. for Soldering Purposes, 1/8" from case for 5-seconds |
300 |