Features: • Very low profile - typical height of 1.1 mm• Ideal for automated placement• Guardring for overvoltage protection• High Barrier Technology, Tj = 175 °C Maximum• Low leakage current• Meets MSL level 1, per J-STD-020C• Solder Dip 260 °C, 40 second...
SS10PH10: Features: • Very low profile - typical height of 1.1 mm• Ideal for automated placement• Guardring for overvoltage protection• High Barrier Technology, Tj = 175 °C MaximumR...
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• Very low profile - typical height of 1.1 mm
• Ideal for automated placement
• Guardring for overvoltage protection
• High Barrier Technology, Tj = 175 °C Maximum
• Low leakage current
• Meets MSL level 1, per J-STD-020C
• Solder Dip 260 °C, 40 seconds
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC
For use in high frequency rectifier of switching mode power supplies, free-wheeling diodes, dc-to-dc converters or polarity protection application.
PARAMETER | SYMBOL | SS10PH9 | SS10PH10 | UNIT |
Device marking code | 10H9 | 1010 | ||
Maximum repetitive peak reverse voltage | VRRM | 9 | 10 | V |
Maximum average forward rectified current (see Fig. 1) | IF(AV) | 10 | A | |
Peak forward surge current 10 ms single half sine-wave superimposed on rated load |
IFSM | 2000 | A | |
Non-repetitive avalanche energy at IAS = 2 A, L = 10 mH, Tj = 25 °C |
EAS | 20 | mJ | |
Voltage rate of change (rated VR) | dv/dt | 10000 | V/s | |
Operating junction and storage temperature range | TJ, TSTG | - 55 to + 175 | °C |