Features: Schottky Barrier Chip Ideally Suited for Automatic Assembly Low Power Loss, High Efficiency Surge Overload Rating to 50A Peak For Use in Low Voltage Application Guard Ring Die Construction Plastic Case Material has UL Flammability Classification Rating 94V-O Specifications Char...
SR24: Features: Schottky Barrier Chip Ideally Suited for Automatic Assembly Low Power Loss, High Efficiency Surge Overload Rating to 50A Peak For Use in Low Voltage Application Guard Ring Die Construc...
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Schottky Barrier Chip
Ideally Suited for Automatic Assembly
Low Power Loss, High Efficiency
Surge Overload Rating to 50A Peak
For Use in Low Voltage Application
Guard Ring Die Construction
Plastic Case Material has UL Flammability Classification Rating 94V-O
Characteristic |
Symbol |
SR22 |
SR23 |
SR24 |
SR25 |
SR26 |
SR28 |
SR29 |
Unit |
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage |
VRRM VRWM
VR |
20 |
30 |
40 |
50 |
60 |
80 |
90 |
V |
RMS Reverse Voltage |
VR(RMS) |
14 |
21 |
28 |
35 |
42 |
56 |
64 |
V |
Average Rectified Output Current @TL = 105°C |
IO |
2.0 |
A | ||||||
Non-Repetitive Peak Forward Surge Current 8.3ms Single half sine-wave superimposed on rated load (JEDEC Method) |
IFSM |
50 |
A | ||||||
Forward Voltage @IF = 2.0A |
VFM |
0.50 |
0.70 |
0.85 |
V | ||||
Peak Reverse Current @TA = 25°C At Rated DC Blocking Voltage @TA = 100°C |
IRM |
0.5 20 |
mA | ||||||
Typical Thermal Resistance Junction to Ambient (Note 1) |
RJA |
75 |
K/W | ||||||
Operating Temperature Range |
Tj |
-65 to +125 |
°C | ||||||
Storage Temperature Range |
TSTG |
-65 to +150 |
°C |