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SPG1316E-H

Features: • 1.6mm(L)×0.8mm(W) small size surface mount type• Thin package of 0.55mm(H) thickness• Transparent clear lens optic• Low power consumption type chip LED• Emitting light green (530nm)• E ; ESD Protected (±2.0KV, 3 Times @100pF, 1.5KΩ)Application&...

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SeekIC No. : 004501095 Detail

SPG1316E-H: Features: • 1.6mm(L)×0.8mm(W) small size surface mount type• Thin package of 0.55mm(H) thickness• Transparent clear lens optic• Low power consumption type chip LED• Emi...

SPG1316E-H Data Sheet

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Part Number:
SPG1316E-H
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• 1.6mm(L)×0.8mm(W) small size surface mount type
• Thin package of 0.55mm(H) thickness
• Transparent clear lens optic
• Low power consumption type chip LED
• Emitting light green (530nm)
• E ; ESD Protected (±2.0KV, 3 Times @100pF, 1.5KΩ)




Application

• LCD backlighting
• Keypad backlighting
• Symbol backlighting
• Front panel indicator lamp




Specifications

Characteristic Symbol Rating Unit
Power dissipation PD 64 mW
Forward current IF 20 mA
*1Peak forward current IFP 50 mA
Operating temperature range Topr -25∼80
Storage temperature range Tstg -30∼100
*2Soldering temperature Tsol 240 for 10 seconds

*1. Duty ratio = 1/16, Pulse width = 0.1ms
*2. Recommended reflow soldering temperature profile - Preheating 150 to 185 within 120 seconds soldering 240 within 10 seconds Gradual cooling (Avoid quenching)




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