HEATPAD SIP .009" SP900
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Technical/Catalog Information | SP900S-105 |
Vendor | Bergquist |
Category | Thermal Management |
Usage | SIP |
Shape | Rectangular |
Material | Silicone/Fiberglass |
Thermal Conductivity | 1.6 W/m-K |
Thermal Resistivity | 0.6°C/W |
Thickness | 0.009" (0.23mm) |
Outline | 36.83mm x 21.28mm |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | SP900S 105 SP900S105 BER179 ND BER179ND BER179 |