THERMAL PAD DO-5 LARGE SP600
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Series: | Sil-Pad® 600 | Manufacturer: | Bergquist | ||
Usage: | DO-5 | Shape: | Round | ||
Outline: | 25.40mm x 6.60mm | Thickness: | 0.009" (0.229mm) | ||
Propagation Delay Time : | 9.2 ns | Material: | Silicone Based | ||
Adhesive: | - | Backing, Carrier: | - | ||
Color: | Green | Thermal Resistivity: | 0.35°C/W |
Technical/Catalog Information | SP600-25 |
Vendor | Bergquist |
Category | Thermal Management |
Usage | DO-5 |
Shape | Round |
Material | Silicone Elastomer |
Thermal Conductivity | 1.6 W/m-K |
Thermal Resistivity | 0.35°C/W |
Thickness | 0.009" (0.229mm) |
Outline | - |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | SP600 25 SP60025 BER105 ND BER105ND BER105 |