Features: • A Complete Voltage Range - 3.3 to 200 Volts• Flat Handling Surface for Accurate Placement• Package Design for Top Side or Bottom Circuit Board Mounting• Available in Tape and ReelApplicationSurface mount board layout is a critical portion of the total design. Th...
SOT-23: Features: • A Complete Voltage Range - 3.3 to 200 Volts• Flat Handling Surface for Accurate Placement• Package Design for Top Side or Bottom Circuit Board Mounting• Available...
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Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package.
The minimum recommended footprint for the SOD-123 is shown at the right.
The SOD-123 package can be used on existing surface mount boards which have been designed for the leadless 34 package style. The footprint compatibility makes conversion from leadless 34 to SOD-123 straightforward.
Rating | Symbol | Value | Unit |
DC Power Dissipation @ TL = 75°C, Measured at Zero Lead Length Derate above 75°C |
PD | 3 40 |
Watts mW/°C |
DC Power Dissipation @ TA = 25°C* Derate above 25°C |
PD | 830 6.6 |
mW mW/°C |
Operating and Storage Junction Temperature Range | TJ, Tstg | 65 to +150 | °C |