Application• Stable at Lead Free process temperatures• Enhanced activity for tough to solder boards and components• High speed stencil printing up to 150mm/sec• Excellent tack performance and printer open time• Extended between-print abandon time• Very cleanab...
SN97CWS157: Application• Stable at Lead Free process temperatures• Enhanced activity for tough to solder boards and components• High speed stencil printing up to 150mm/sec• Excellent tac...
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SN97CWS157 (Sn/3.0Ag/0.5Cu) WS150 Lead Free Water Washable Solder Paste is specifically designed for lead free solder processes. It displays previously unseen level of repeatability and consistency. This paste offers an excellent open time, extended abandon time and good soldering activity at the elevated processing temperatures required for lead free alloys.