SN97CWS157

Application• Stable at Lead Free process temperatures• Enhanced activity for tough to solder boards and components• High speed stencil printing up to 150mm/sec• Excellent tack performance and printer open time• Extended between-print abandon time• Very cleanab...

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SeekIC No. : 004499821 Detail

SN97CWS157: Application• Stable at Lead Free process temperatures• Enhanced activity for tough to solder boards and components• High speed stencil printing up to 150mm/sec• Excellent tac...

floor Price/Ceiling Price

Part Number:
SN97CWS157
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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evaluate  (4.8 stars)

Upload time: 2024/12/24

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Product Details

Description



Application

• Stable at Lead Free process temperatures
• Enhanced activity for tough to solder boards and components
• High speed stencil printing up to 150mm/sec
• Excellent tack performance and printer open time
• Extended "between-print" abandon time
• Very cleanable post solder residues



Description

SN97CWS157 (Sn/3.0Ag/0.5Cu) WS150 Lead Free Water Washable Solder Paste is specifically designed for lead free solder processes. It displays previously unseen level of repeatability and consistency. This paste offers an excellent open time, extended abandon time and good soldering activity at the elevated processing temperatures required for lead free alloys.




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