Features: • Low profile package with built-in strain relief for surface mounted applications• Glass passivated junction• Low inductance• Excellent clamping capability• Repetition rate (duty cycle): 0.01%• Fast response time: theoretically (with no parisitic indu...
SM6T Series: Features: • Low profile package with built-in strain relief for surface mounted applications• Glass passivated junction• Low inductance• Excellent clamping capability• ...
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• Low profile package with built-in strain relief for surface mounted applications
• Glass passivated junction
• Low inductance
• Excellent clamping capability
• Repetition rate (duty cycle): 0.01%
• Fast response time: theoretically (with no parisitic inductance) less than 1ps from 0 Volts to V(BR) for unidirectional and 5ns for bidirectional types
• High temperature soldering: 250°C/10 seconds at terminals
• Plastic package has Underwriters Laboratory Flammability Classificaion 94V-0
Parameter | Symbol | Value | Unit |
Peak pulse power dissipation on 10/1000µs waveform(1)(2) (Fig. 1) |
PPPM | Minimum 600 | W |
Peak pulse current with a 10/1000µs waveform(1) | IPPM | See Next Table | A |
Power dissipation on infinite heatsink, TA = 50 | PM(AV) | 5.0 | W |
Peak forward surge current 10ms single half sine-wave uni-directional only(2) |
IFSM | 100 | A |
Thermal resistance junction to ambient air(3) | RJA | 100 | /W |
Thermal resistance junction to leads | RJL | 20 | /W |
Operating junction and storage temperature range | TJ, TSTG | 65 to +150 |