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SL1711

Features: · Single chip system for wideband quadrature downconversion· Compatible with all standard high IF frequencies· Excellent gain and phase match up to 30MHz baseband· High output referred linearity for low distortion and multi channel application· Simple low component application· Fully bal...

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SeekIC No. : 004492451 Detail

SL1711: Features: · Single chip system for wideband quadrature downconversion· Compatible with all standard high IF frequencies· Excellent gain and phase match up to 30MHz baseband· High output referred lin...

SL1711 Data Sheet

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Part Number:
SL1711
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/23

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Product Details

Description



Features:

· Single chip system for wideband quadrature downconversion
· Compatible with all standard high IF frequencies
· Excellent gain and phase match up to 30MHz baseband
· High output referred linearity for low distortion and multi channel application
· Simple low component application
· Fully balanced low radiation design with fully integrated quadrature generation
· High operating input sensitivity
· On-board AGC facility
· On chip oscillator for varactor tuning or SAW resonator operation
· ESD protection (Normal ESD handling procedures should be observed)


Application

· Satellite receiver systems
· Data communications systems
· Cable systems


Pinout

Connection Diagram


Specifications

Characteristics Min Max Units Conditions
Supply voltage, Vcc -0.3 7 V  
IFFIN &IFINB input voltage   2.5 Vp-p  
IFIN & IFINB input DC offset -0.3 Vcc+0.3 V  
IOUT & QOUT DC offset -0.3 Vcc+0.3 V  
AGC DC offset -0.3 Vcc+0.3 V  
VCO1 & 2 DC offset -0.3 Vcc+0.3 V  
VCODDIS DC offset -0.3 Vcc+0.3 V  
PSCAL & PSCALB DC offset -0.3 Vcc+0.3 V  
Storage temperature -55 125 °C  
Junction temperature   150 °C  
PSOP16 package thermal
resistance, chip to ambient		   TBA °C/W  
PSOP16 package thermal
resitance, chip to case		   TBA °C/W  
MP16 package thermal resistance
chip to Ambient		   81 °C/W  
MP16 package thermal resistance
chip to case		   28 °C/W  
Power consumption at 5.25V   657 mW  
ESD protection 2   kV Mil std 883B method 3015 cat 1



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