Features: • Heat transfer through aluminium oxide ceramic isolated metal baseplate• Chip soldered on direct copper bonded Al2O3 ceramic• Thyristor with amplifying gate• UL recognized, file no. E 63 532Application• DC motor control (e.g. for machine tools)• Tempe...
SKKT 213: Features: • Heat transfer through aluminium oxide ceramic isolated metal baseplate• Chip soldered on direct copper bonded Al2O3 ceramic• Thyristor with amplifying gate• UL re...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
• Heat transfer through aluminium oxide ceramic isolated metal baseplate
• Chip soldered on direct copper bonded Al2O3 ceramic
• Thyristor with amplifying gate
• UL recognized, file no. E 63 532