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SK52-T3

Features: Schottky Barrier Chip Ideally Suited for Automatic AssemblyLow Power Loss, High EfficiencySurge Overload Rating to 175A PeakFor Use in Low Voltage ApplicationGuard Ring Die ConstructionPlastic Case Material has UL Flammability Classification Rating 94V-OSpecifications Characteristic...

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SeekIC No. : 004491873 Detail

SK52-T3: Features: Schottky Barrier Chip Ideally Suited for Automatic AssemblyLow Power Loss, High EfficiencySurge Overload Rating to 175A PeakFor Use in Low Voltage ApplicationGuard Ring Die ConstructionPla...

SK52-T3 Data Sheet

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Part Number:
SK52-T3
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/23

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Product Details

Description



Features:

 Schottky Barrier Chip
Ideally Suited for Automatic Assembly
 Low Power Loss, High Efficiency
 Surge Overload Rating to 175A Peak
 For Use in Low Voltage Application
 Guard Ring Die Construction
 Plastic Case Material has UL Flammability
   Classification Rating 94V-O


Specifications

Characteristic
Symbol
SK52
SK53
SK54
SK55
SK56
SK58
SK59
S510
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
20
30
40
50
60
70
80
90
V
RMS Reverse Voltage
VR(RMS)
14
21
28
35
42
56
64
71
V
Average Rectified Output Current @TL = 90°C
IO
50.
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
175
A
Forward Voltage @IF = 5.0A
VFM
0.50
0.75
0.85
V
Peak Reverse Current @TA = 25°C
At Rated DC Blocking Voltage @TA = 100°C
IRM
0.5
20
mA
Typical Thermal Resistance (Note 1)
RJL
RJA
14
50
°C/W
Operating Temperature Range
Tj
-65 to +125
°C
Storage Temperature Range
TSTG
-65 to +150
°C



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