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SK12 S110

Features: · Schottky Barrier Chip· Ideally Suited for Automatic Assembly · Low Power Loss, High Efficiency· Surge Overload Rating to 30A Peak · For Use in Low Voltage Application ·Guard Ring Die Construction · Plastic Case Material has UL Flammability Classification Rating 94V-O Specifications ...

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SeekIC No. : 004491743 Detail

SK12 S110: Features: · Schottky Barrier Chip· Ideally Suited for Automatic Assembly · Low Power Loss, High Efficiency· Surge Overload Rating to 30A Peak · For Use in Low Voltage Application ·Guard Ring Die Con...

SK12 S110 Data Sheet

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Part Number:
SK12 S110
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/12/22

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Product Details

Description



Features:

·  Schottky Barrier Chip
·  Ideally Suited for Automatic Assembly   
·  Low Power Loss, High Efficiency
·  Surge Overload Rating to 30A Peak     
·  For Use in Low Voltage Application     
·  Guard Ring Die Construction           
·  Plastic Case Material has UL Flammability Classification Rating 94V-O            




Specifications

Characteristic
 Symbol
SK12
SK13
SK14
SK15
SK16
SK18
SK19
S110
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
20
30
40
50
60
80
90
100
V
RMS Reverse Voltage
VR(RMS)
14
21
28
35
42
56
64
71
V
Average Rectified Output Current @TL = 75
IO
1.0
A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
30
A
Forward Voltage @IF = 1.0A
VFM
0.55
0.70
0.85
V
Peak Reverse Current @TA = 25
At Rated DC Blocking Voltage @TA = 100
IRM
0.5
20
mA
Typical Thermal Resistance Junction to Ambient
(Note 1)
RJA
95
K/W
Operating Temperature Range
Tj
-65 to +125
Storage Temperature Range
TSTG
-65 to +150


Note: 1. Mounted on P.C. Board with 5.0mm copper pad areas




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