SG6000JX28

The SG6000JX28 is designed for inverter application.TOSHIBA is continually working to improve the quality and the reliability of its products. Nevertheless,semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress.

The SG6000JX28 has the following features including:(1)repetitive peak off-state voltage:Vdrm=6000 V; (2)R.M.S on-state current:IT (RMS)=2700 A; (3)peak turn-off current:ITGQM=6000 A; (4)critical rate of rise of on-state current:di/dt=500 A/s; (5)critical rate of rise of off-state voltage:dv/dt=1250 V/s.Toshiba is continually working to improve the quality and the reliability of their products.Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and their vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Toshiba products, to observe standards of safety, and to avoid situations in which the malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to property.

The absolute maximum ratings of the SG6000JX28 are:(1)storage temperature range:-40 to 150; (2)operating junction temperature range:-40 to 125; (3)repetitive peak off-state voltage:6000V; (4)R.M.S on-state current:2700A;(5)average forward gate power disspation:190W.The maximum ratings are the limit values which must not be exceeded during operation of device. None of these rating value must not be exceeded. If the maximum rating value is exceeded, the characteristics of devices may never be restored properly. In extreme cases, the device may be permanently damages.Some optical modules come with a protective cap.The protective cap is used to avoid malfunction when the optical module is not in use. Note that it is not dust or waterproof.As mentioned before, optical modules are optical components. Thus, in principle,soldering where there may be flux residue and flux removal after soldering is not recommended.Toshiba recommend that soldering be performed without the optical module mounted on the board.Then, after the board has been cleaned, the optical module should be soldered on to the board manually.

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