Features: ` High ruggedness` RDS(on) (Max 0.85 )@VGS=10V` Gate Charge (Typical 48nC)` Improved dv/dt Capability, High ruggedness` 100% Avalanche Tested` Maximum Junction Temperature Range (150°C)Specifications Symbol Parameter Value Units VDSS Drain to Source Voltage 50...
SFP840: Features: ` High ruggedness` RDS(on) (Max 0.85 )@VGS=10V` Gate Charge (Typical 48nC)` Improved dv/dt Capability, High ruggedness` 100% Avalanche Tested` Maximum Junction Temperature Range (150°C)Sp...
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Symbol |
Parameter |
Value |
Units |
VDSS |
Drain to Source Voltage |
500 |
V |
ID |
Continuous Drain Current (@ TC=25) |
8 |
A |
Continuous Drain Current (@ TC=100) |
5.1 |
A | |
IDM |
Drain Current Pulsed (Note 1) |
32 |
A |
VGS |
Gate to Source Voltage |
±30 |
V |
EAS |
Single Pulsed Avalanche Energy (Note 2) |
660 |
mJ |
EAR |
Repetitive Avalanche Energy (Note 1) |
12.5 |
mJ |
dv/dt |
Peak Diode Recovery dv/dt (Note 3) |
5 |
V/ns |
PD |
Total Power Dissipation (@ TC=25) |
125 |
W |
Derating Factor above 25 °C |
1.0 |
W/°C | |
TSTG,TJ |
Operating Junction Temperature & Storage Temperature |
- 55 ~ 150 |
°C |
TL |
Maximum Lead Temperature for soldering purpose, 1/8 from Case for 5 seconds. |
300 |
°C |