SFC2309-200

Features:

` Flip Chip bidirectional EMI/RFI filter with integrated ESD protection
` ESD protection to
  IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)
  IEC 61000-4-4 (EFT) 40A (5/50ns)
` Filter performance: 25dB minimum attenuation 800MHz to 3GHz
` TVS working voltage: 5V
` Resistor: 200
` Input Capacitance:45pF
` Protection and filtering for ten lines


Application

` Color LCD Panel Protection
` Cell Phone Handsets and Accessories
` Personal Digital Assistants (PDA's)
` Notebook & Hand Held Computers


Specifications

Rating	Symbol	Value	Units
ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Contact)	VESD	± 15 ± 12	kV
Junction Temperature	TJ	125	°C
Operating Temperature	Top	-40 to +85	°C
Storage Temperature	TSTG	-55°C to 150°C	°C

Description

The SFC2309-200 is a low pass filter array with integrated TVS diodes. SFC2309-200 is designed to suppress unwanted EMI/RFI signals and provide electrostatic discharge (ESD) protection in portable electronic equipment. This state-of-the-art device utilizes solidstate silicon-avalanche technology for superior clamping performance and DC electrical characteristics.They have been optimized for protection of color LCD panels in cellular phones and other portable electronics.

The SFC2309-200 consists of ten identical circuits comprised of TVS diodes for ESD protection, and a resistor-capacitor network for EMI/RFI filtering. A series resistor value of 200 and a capacitance value of 45pF is used to achieve 25dB minimum attenuation from 800MHz to 3GHz. Each line features two stages of TVS diode protection. The TVS diodes provide effective suppression of ESD voltages in excess of ±15kV (air discharge) and ±8kV (contact discharge) per IEC 61000-4-2, level 4.

The SFC2309-200 is a 25-bump, 0.5mm pitch flip chip array with a 5x5 bump grid. SFC2309-200 measures 2.6 x 2.6 x 0.65mm. The solder bumps have a nominal diameter of 0.315mm.