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SF50MG

Features: ·Glass passivated chip·Super fast switching time for high efficiency·Low forward voltage drop and high current capability·Low reverse leakage current·Plastic material has UL flammability classification 94V-0SpecificationsRatings at 25 ambient temperature unless otherwise specified.Single...

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SeekIC No. : 004488049 Detail

SF50MG: Features: ·Glass passivated chip·Super fast switching time for high efficiency·Low forward voltage drop and high current capability·Low reverse leakage current·Plastic material has UL flammability c...

SF50MG Data Sheet

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Part Number:
SF50MG
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/9/29

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Product Details

Description



Features:

·Glass passivated chip
·Super fast switching time for high efficiency
·Low forward voltage drop and high current capability
·Low reverse leakage current
·Plastic material has UL flammability classification 94V-0


Specifications

Ratings at 25 ambient temperature unless otherwise specified.Single phase, half wave, 60Hz, resistive or inductive load.For capacitive load, derate current by 20%

TYPE NUMBER
SYMBOL
SF50KG
SF50MG
UNITS
Maximum Recurrent Peak Reverse Voltage
VRRM
800
1000
V
Maximum RMS Voltage
VRMS
560
700
V
Maximum DC Blocking Voltage
VDC
800
1000
V
Maximum Average Forward Rectified Current
at TA = 55
I(AV)
5.0
A
Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method)
IFSM
150
A
Typical Thermal Resistance@5.0A DC
VF
1.5
1.7
V
Maximum DC Reverse Current @ TA=25
at Rated DC Blocking Voltage @ TA=100
IR

5
300
uA
Maximum Reverse Recovery Time (Note 1)
Trr
50
ns
Typical Junction Capacitance (Note 2)
CJ
35
pF
Typical Thermal Resistance (Note 3)
RJA
25
Operating and Storage Temperature Range
TJ,TSTG
-55 to +150
NOTES : 1.Measured with IF=0.5A,IR=1.0A,IRR=0.25A.
              2.Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
              3.Thermal Resistance Junction to Ambient.


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