SBG3030CT

Features: Schottky Barrier ChipGuard Ring Die Construction for Transient ProtectionLow Power Loss, High EfficiencyHigh Surge CapabilityHigh Current Capability and Low Forward Voltage DropSurge Overload Rating to 250A PeakFor Use in Low Voltage, High Frequency Inverters,Free Wheeling, and Polarity ...

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SBG3030CT Picture
SeekIC No. : 004484984 Detail

SBG3030CT: Features: Schottky Barrier ChipGuard Ring Die Construction for Transient ProtectionLow Power Loss, High EfficiencyHigh Surge CapabilityHigh Current Capability and Low Forward Voltage DropSurge Overl...

floor Price/Ceiling Price

Part Number:
SBG3030CT
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/11/24

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Product Details

Description



Features:

Schottky Barrier Chip
Guard Ring Die Construction for Transient Protection
Low Power Loss, High Efficiency
High Surge Capability
High Current Capability and Low Forward Voltage Drop
Surge Overload Rating to 250A Peak
For Use in Low Voltage, High Frequency Inverters,
Free Wheeling, and Polarity Protection Applications
Lead Free Finish/RoHS Compliant Version (Note 3)





Specifications

Characteristic

Symbol

SBG
2030CT

SBG
2035CT

SBG
2040CT

SBG
2045CT

Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

VRRM
VRWM
VR

30

35

40

45

V

RMS Reverse Voltage

VR(RMS)

21

25

28

32

V

Average Rectified Output Current @ TC = 105

IO

30

A

Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on rated load
(JEDEC Method)

IFSM

250

A

Forward Voltage, per Element @ IF = 10A

VFM

0.55

V

Peak Reverse Current @ Tj = 25
at Rated DC Blocking Voltage @ Tj = 100

IRM

1.0
75

mA

Typical Junction Capacitance (Note 2)

Cj

420

pF

Typical Thermal Resistance Junction to Case (Note 1)

RJC

1.5

K/W

Operating and Storage Temperature Range

Tj, TSTG

-65 to +150






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