Features: Schottky Barrier ChipGuard Ring Die Construction for Transient ProtectionLow Power Loss, High EfficiencyHigh Surge CapabilityHigh Current Capability and Low Forward Voltage DropSurge Overload Rating to 250A PeakFor Use in Low Voltage, High Frequency Inverters,Free Wheeling, and Polarity ...
SBG3030CT: Features: Schottky Barrier ChipGuard Ring Die Construction for Transient ProtectionLow Power Loss, High EfficiencyHigh Surge CapabilityHigh Current Capability and Low Forward Voltage DropSurge Overl...
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Characteristic |
Symbol |
SBG |
SBG |
SBG |
SBG |
Unit |
Peak Repetitive Reverse Voltage |
VRRM |
30 |
35 |
40 |
45 |
V |
RMS Reverse Voltage |
VR(RMS) |
21 |
25 |
28 |
32 |
V |
Average Rectified Output Current @ TC = 105 |
IO |
30 |
A | |||
Non-Repetitive Peak Forward Surge Current |
IFSM |
250 |
A | |||
Forward Voltage, per Element @ IF = 10A |
VFM |
0.55 |
V | |||
Peak Reverse Current @ Tj = 25 |
IRM |
1.0 |
mA | |||
Typical Junction Capacitance (Note 2) |
Cj |
420 |
pF | |||
Typical Thermal Resistance Junction to Case (Note 1) |
RJC |
1.5 |
K/W | |||
Operating and Storage Temperature Range |
Tj, TSTG |
-65 to +150 |