SA305

Features: • LOW COST 3 PHASE INTELLIGENT SWITCHING AMPLIFIER• 3 FULLY PROTECTED HALF BRIDGES• UP TO 60V SUPPLY• OUTPUT CURRENT - 5 AMPS (CONT) PER HALF BRIDGE• NO SHOOT THROUGH CURRENTApplication• 3 PHASE BRUSHLESS DC MOTORS• 3 INDEPENDENT SOLENOID ACTUA...

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SA305 Picture
SeekIC No. : 004483616 Detail

SA305: Features: • LOW COST 3 PHASE INTELLIGENT SWITCHING AMPLIFIER• 3 FULLY PROTECTED HALF BRIDGES• UP TO 60V SUPPLY• OUTPUT CURRENT - 5 AMPS (CONT) PER HALF BRIDGE• NO SHOO...

floor Price/Ceiling Price

Part Number:
SA305
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

• LOW COST 3 PHASE INTELLIGENT SWITCHING AMPLIFIER
• 3 FULLY PROTECTED HALF BRIDGES
• UP TO 60V SUPPLY
• OUTPUT CURRENT - 5 AMPS (CONT) PER HALF BRIDGE
• NO "SHOOT THROUGH" CURRENT





Application

• 3 PHASE BRUSHLESS DC MOTORS
• 3 INDEPENDENT SOLENOID ACTUATORS





Specifications

SUPPLY VOLTAGE, +Vs .....................................60V
SUPPLY VOLTAGE, Vcc ....................................5.5V
OUTPUT CURRENT, peak, 200ms .....................10A
POWER DISSIPATION, internal, DC ..................TBD
TEMPERATURE, pin solder, 10s ....................225°C.
TEMPERATURE, junction2 .............................150°C.
TEMPERATURE RANGE, storage........ −55 to 125°C.
OPERATING TEMPERATURE, case........ −40 to 85°C.





Description

The SA305 is an integrated, fully protected, 3 phase brushless DC motor driver IC. Three independent half bridges provide up to 5A of continuous (10A peak) output current under microcontroller or DSP control.

Thermal, short circuit, shoot through, and over current protection are included in this power device. Fault status indication and current level monitors are provided directly to the controller. The SA305 is built using a multi-technology process allowing CMOS logic control and DMOS output power devices on the same IC. Output current is measured using an innovative low loss technique. The SIP package offers superior thermal performance with a flexible footprint.






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