Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product itself will remain within RoHS compliant version.Application·Backlighting in dashboard and switch.·...
S2C-FM2P1VY: Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.`The product...
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Features: ·P-LCC-2 package.·High flux output.·High current capability.·White package.·Optical indi...
Parameter |
Symbol |
Rating |
Unit |
Reverse Voltage |
VR |
5 |
V |
Forward Current |
IF |
25 |
mA |
Operating Temperature |
Topr |
-40 ~ +85 |
|
Storage Temperature |
Tstg |
-40 ~ +90 |
|
Electrostatic Discharge(HBM) |
ESD |
2000 |
V |
Power Dissipation |
Pd |
60 |
mW |
Peak Forward Current (Duty 1/10 @1KHz) |
IFP |
60 |
mA |
Soldering Temperature |
Tsol |
Reflow Soldering : 260 for 10 sec. Hand Soldering : 350 for 3 sec. |
The S2C-FM2P1VY SMD Taping is much smaller than lead frame type components, thus enable smaller board size,
higher packing density, reduced storage space and finally smaller equipment to be obtained.
·Besides, lightweight makes S2C-FM2P1VY ideal for miniature applications. etc.