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RLP1N06CLE

Features: • 1A, 55V• rDS(ON) = 0.750W• ILIMIT at 150oC = 1.1A to 1.5A Maximum• Built-in Voltage Clamp• Built-in Current Limiting• ESD Protected, 2kV Minimum• Controlled Switching Limits EMI and RFI• 175 Rated Junction Temperature• Logic Level G...

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SeekIC No. : 004477659 Detail

RLP1N06CLE: Features: • 1A, 55V• rDS(ON) = 0.750W• ILIMIT at 150oC = 1.1A to 1.5A Maximum• Built-in Voltage Clamp• Built-in Current Limiting• ESD Protected, 2kV Minimum•...

RLP1N06CLE Data Sheet

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Part Number:
RLP1N06CLE
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/9

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Product Details

Description



Features:

• 1A, 55V
• rDS(ON) = 0.750W
• ILIMIT at 150oC = 1.1A to 1.5A Maximum
• Built-in Voltage Clamp
• Built-in Current Limiting
• ESD Protected, 2kV Minimum
• Controlled Switching Limits EMI and RFI
• 175 Rated Junction Temperature
• Logic Level Gate
• Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"


Specifications

Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VDSS                      55             V
Drain to Gate Voltage (RGS = 20kW, Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR                       55             V
Electrostatic Voltage at TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ESD                         2               kV
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID                          Self           Limited
Gate to Source Voltage (Reverse Voltage Gate Bias Not Allowed) . . . . . . . . . . . . . . . . . . . .VGS                         5.5            V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .PD                          36             W
Power Dissipation Derating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .                        0.24         W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  . . .TJ, TSTG                  -55 to 175  
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL                            300           
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg                             260           



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