Features: `PROPRIETARY JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE SOFT GLASS`VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)`EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES`LOW FORWARD VOLT...
RGP108: Features: `PROPRIETARY JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE SOFT GLASS`VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typ...
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`PROPRIETARY JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE SOFT GLASS
`VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
`EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
`LOW FORWARD VOLTAGE DROP
`1A at TA = 75 WITH NO THERMAL RUNAWAY
Parameter |
Symbol |
RGP100 | RGP101 | RGP102 | RGP104 | RGP106 | RGP108 | RGP110 | Unit |
Maximum DC Blocking Voltage |
VRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 |
V |
Maximum RMS Voltage |
VRMS |
35 |
70 |
140 |
140 |
420 |
560 |
700 |
V |
Maximum Peak Recurrent Reverse Voltage |
VRRM |
50 |
100 |
200 |
200 |
600 |
800 |
1000 |
V |
Average Forward Rectified Current @ TA= 75 C, Lead length = 0.375 in. (9.5 mm) |
IO |
1.0 |
A | ||||||
Peak Forward Surge Current ( 8.3 mSec single half sine wave superimposed on rated load) |
IFSM |
50 |
A | ||||||
Maximum Forward Voltage at 1 Amp DC |
VFM |
1.2 |
V | ||||||
Maximum Reverse Recovery Time (IF =0.5A, IR =1A, IRR =0.25A) |
TRR |
150 |
250 |
500(Note 3) |
nS | ||||
Maximum Average DC Reverse Current @TA = 25 At Rated DC Blocking Voltage @TA = 100 |
IRM |
0.5 25 |
A | ||||||
Typical Thermal Resistance, Junction to Ambient (Note 1) |
RJA |
55 |
°C/W | ||||||
Typical Junction Capacitance (Note 2) |
CJ |
15 |
pF | ||||||
Operating and Storage Temperature Range |
TJ,TSTG |
- 65 to + 175 |
°C |