ApplicationElectronic household appliances, office equipment, audio equipment, consumer products, automotive, etc.PinoutSpecifications Symbol Parameter Condition Rated Value Unit VCC/AVCC Supply voltage −0.3 to 6.5 V VI Input voltage −0.3 to VCC + 0.3 V VO...
R5F21262SNFP: ApplicationElectronic household appliances, office equipment, audio equipment, consumer products, automotive, etc.PinoutSpecifications Symbol Parameter Condition Rated Value Unit VCC/A...
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Symbol |
Parameter |
Condition | Rated Value | Unit |
VCC/AVCC | Supply voltage | −0.3 to 6.5 | V | |
VI | Input voltage | −0.3 to VCC + 0.3 | V | |
VO | Output voltage | −0.3 to VCC + 0.3 | V | |
Pd | Power dissipation | Topr = 25°C | 500 | mW |
Topr | Operating ambient temperature | −20 to 85 (N version) / −40 to 85 (D version) |
°C | |
Tstg | Storage temperature | −65 to 150 | °C |
These MCUs of R5F21262SNFP are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data flash (1 KB × 2 blocks).
The difference between the R8C/26 Group and R8C/27 Group is only the presence or absence of data flash. Their peripheral functions are the same.