Features: • Small package dimensions of 3.2(L) x 2.8(W) x 1.8(H) mm• AllnGaP technology for -Y, -O, -R, and -E• InGaN technology for -IB, -IC, and -IG• Wide viewing angle of 120°• Water clear optics• Available in 0.315 (8mm) width tape on 7 (178mm) diameter re...
QTLP673C: Features: • Small package dimensions of 3.2(L) x 2.8(W) x 1.8(H) mm• AllnGaP technology for -Y, -O, -R, and -E• InGaN technology for -IB, -IC, and -IG• Wide viewing angle of ...
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Features: • Wide viewing angle of 120°• Water clear optics• Moisture-proof packa...
Parameter |
Symbol |
QTLP673C-Y/-E/-O/-R |
Units |
Continuous Forward Current |
IF |
70 |
mA |
Peak Forward Current (f = 100 KHz, Duty Factor = 1/10) |
IFM |
100 |
mA |
Reverse Voltage |
VR |
5 |
V |
Power Dissipation |
PD |
180 |
mW |
Junction Temperature |
TJ |
125 |
°C |
Operating Temperature |
TOPR |
-40 to +100 |
°C |
Storage Temperature |
TSTG |
-40 to +100 |
°C |
Lead Soldering Time |
TSOL |
260 for 5 sec |
°C |
The QTLP673C is designed with flat top and sides for the ease of pick-and-place by automatic placement equipment. It is compatible with both IR reflow and TTW (Through-the-Wave) soldering. The QTLP673C is ideal for backlighting and optical coupling into light pipes.