Features: • AllnGaP technology for -T, -S, -R, -E, -O, -Y and -AG • Water clear optics• InGaN/SiC technology for -IG, -IB and -IW • Available in 0.315 (8mm) width tape on7 (178mm) diameter reel; 2,000 units per reel• Wide viewing angle of 120° Application• Aut...
QTLP670C-AG: Features: • AllnGaP technology for -T, -S, -R, -E, -O, -Y and -AG • Water clear optics• InGaN/SiC technology for -IG, -IB and -IW • Available in 0.315 (8mm) width tape on7 ...
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Features: • Wide viewing angle of 120°• Water clear optics• Moisture-proof packa...
Parameter |
Symbol |
QTLP670C |
Units | ||||||
-T |
-S |
-R |
-E |
-O |
-Y |
-AG | |||
Continuous Forward Current |
IF |
30 |
30 |
30 |
30 |
30 |
25 |
30 |
mA |
Peak Forward Current (f = 1.0 KHz, Duty Factor = 1/10) |
IFM |
160 |
160 |
160 |
160 |
160 |
120 |
160 |
mA |
Reverse Voltage (IR = 10 A) |
VR |
5 |
5 |
5 |
5 |
5 |
5 |
5 |
V |
Power Dissipation |
PD |
72 |
72 |
72 |
72 |
72 |
60 |
72 |
mW |
Junction Temperature |
TJ |
100 |
100 |
100 |
100 |
100 |
100 |
100 |
°C |
Thermal Resistance (Junction-Air) |
Rth JA |
500 |
500 |
500 |
500 |
500 |
500 |
500 |
K/W |
Operating Temperature |
TOPR |
-40 to +95 |
°C | ||||||
Storage Temperature |
TSTG |
-40 to +100 |
°C | ||||||
Lead Soldering Time |
TSOL |
260 for 5 sec |
°C |
The QTLP670C-AG is designed with flat top and sides for the ease of pick-and-place by automatic placement equipment. They are com patible with convective IR and vapor phase reflow soldering. The package size and configuration conform to EIA-535 BAAC standard specification for case size 3528 tantalum capacitor. The QTLP670C-AG is ideal for backlighting and optical coupling into light pipes.