Features: • Small footprint - 3.2(L) X 2.4(W) X 2.6(H) mm• AllnGaP technology for -R, -E, -O, -Y and -AG• InGaN/SiC technology for -IG and -IB• Narrow viewing angle of 30°• Water clear optics• Moisture-proof packaging• Available in 0.315 (8mm) width tape ...
QTLP660C: Features: • Small footprint - 3.2(L) X 2.4(W) X 2.6(H) mm• AllnGaP technology for -R, -E, -O, -Y and -AG• InGaN/SiC technology for -IG and -IB• Narrow viewing angle of 30°...
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Features: • Wide viewing angle of 120°• Water clear optics• Moisture-proof packa...
• Small footprint - 3.2(L) X 2.4(W) X 2.6(H) mm
• AllnGaP technology for -R, -E, -O, -Y and -AG
• InGaN/SiC technology for -IG and -IB
• Narrow viewing angle of 30°
• Water clear optics
• Moisture-proof packaging
• Available in 0.315" (8mm) width tape on 7" (178mm) diameter reel; 2,000 units per reel
Parameter |
Symbol |
QTLP630C |
Units | ||||
-R |
-E |
-O |
-Y |
-AG | |||
Continuous Forward Current |
IF |
30 |
30 |
30 |
25 |
30 |
mA |
Peak Forward Current (f = 1.0 KHz, Duty Factor = 1/10) |
IFM |
160 |
160 |
160 |
120 |
160 |
mA |
Reverse Voltage |
VR |
5 |
5 |
5 |
5 |
5 |
V |
Power Dissipation |
PD |
72 |
72 |
72 |
60 |
72 |
mW |
Operating Temperature |
TOPR |
-40 to +85 |
°C | ||||
Storage Temperature |
TSTG |
-40 to +90 |
°C | ||||
Lead Soldering Time |
TSOL |
260 for 5 sec |
°C |