QIP0640001

Features: · Low Drive Power· Low VCE(sat)· Discrete Super-Fast Recovery (70ns) Free-Wheel Diode· Isolated Base plate for Easy Heat sinking·Fully Hermetic Package · Package Design Capable of Use at High Altitudes·Package can be modified to adhere to customer dimensions.· High Capacity Diodes (D1 &a...

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SeekIC No. : 004468089 Detail

QIP0640001: Features: · Low Drive Power· Low VCE(sat)· Discrete Super-Fast Recovery (70ns) Free-Wheel Diode· Isolated Base plate for Easy Heat sinking·Fully Hermetic Package · Package Design Capable of Use at H...

floor Price/Ceiling Price

Part Number:
QIP0640001
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/9/26

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Product Details

Description



Features:

· Low Drive Power
· Low VCE(sat)
· Discrete Super-Fast Recovery (70ns) Free-Wheel Diode
· Isolated Base plate for Easy Heat sinking
·Fully Hermetic Package
· Package Design Capable of Use at High Altitudes
·Package can be modified to adhere to customer dimensions.
· High Capacity Diodes (D1 & D3)



Application

· AC Motor Control
· Motion/Servo Control
· Air Craft Applications




Specifications

Ratings Symbol   Units
Collector Emitter Voltage VCES 600 Volts
Gate Emitter Voltage VGES ±20 Volts
Collector Current IC 400 Amperes
Peak Collector Current ICM 800* Amperes
Diode Forward Current(D2,D4) IFM 400 Amperes
Diode Forward Surge Current(D2,D4) IFM 800* Amperes
Power Dissipation(D1,D3) Pd 400 Amperes
V Isolation VRMS 2500 Volts



Description

Powerex IGBT Hermetic modules QIP0640001 are designed for use in switching applications. Each Module consists of two IGBT transistors, four super fast free wheel diodes in an asymmetrical half bridge configuration with each transistor having a reverse connected super fast recovery free wheel diode. All components QIP0640001 are located in a hermetically sealed chamber and are electrically isolated from the heat sinking base plate, offering simplified system assembly and thermal management.




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