HEATPAD POWER MODULE .005" Q3
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Technical/Catalog Information | Q3-67 |
Vendor | Bergquist |
Category | Fans, Thermal Management |
Usage | SIP, Power Module |
Shape | Rectangular |
Material | Graphite Elastomer |
Thermal Conductivity | 2 W/m-K |
Thermal Resistivity | 0.35°C/W |
Thickness | 0.005" (0.127mm) |
Outline | 38.10mm x 22.86mm |
Lead Free Status | Lead Free |
RoHS Status | RoHS Compliant |
Other Names | Q3 67 Q367 BER136 ND BER136ND BER136 |