Q1005-BD

Features: ·On-Chip Prescaler·+6.0 dBm Output Power·-88 dBc/Hz @ 100KHz Phase Noise·-40 dBc Harmonic Suppression·110mA @ 4.0V Bias Supply·100% On-Wafer, DC and Output Power Testing·100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Voltage (Vee1,2,3) +5.0 VDC Supply Vol...

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SeekIC No. : 004467571 Detail

Q1005-BD: Features: ·On-Chip Prescaler·+6.0 dBm Output Power·-88 dBc/Hz @ 100KHz Phase Noise·-40 dBc Harmonic Suppression·110mA @ 4.0V Bias Supply·100% On-Wafer, DC and Output Power Testing·100% Visual Inspec...

floor Price/Ceiling Price

Part Number:
Q1005-BD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

·On-Chip Prescaler
·+6.0 dBm Output Power
·-88 dBc/Hz @ 100KHz Phase Noise
·-40 dBc Harmonic Suppression
·110mA @ 4.0V Bias Supply
·100% On-Wafer, DC and Output Power Testing
·100% Visual Inspection to MIL-STD-883 Method 2010




Specifications

</TABLE
Supply Voltage (Vee1,2,3) +5.0 VDC
Supply Voltage (Vtune) +7.0 VDC
Supply Current (Icc1,2,3) 150 mA
Supply Current (Itune) 1 mA
Storage Temperature (Tstg) -65 to +165 OC
Operating Temperature (Ta) -55 to MTTF Table 1
Junction Temperature (Tjn) MTTF Table 1


(1) Junction temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.




Description

Mimix Broadband's Q1005-BD 14.2-15.2 GHz GaAs HBT VCO is a fully integrated oscillator MMIC with on-chip frequency doubler and divide-by-8 prescaler (w.r.t RFout). This design is based on a cross coupled differential pair with on-chip tuning diode and resonator. The use of a high-Q resonator structure and integrated varactor diodes results in optimum phase-noise performance, whilst the integration of frequency doubler and prescaler reduce application complexity and time-to-market. This MMIC uses Mimix Broadband's 2 um GaAs HBT device model technology to ensure low flicker (1/f ) noise and high reliability. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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