Q1001-BD

Features: ·On-Chip Resonator·+5.0 dBm Output Power·-97 dBc/Hz @ 100KHz Phase Noise·20mA @ -5.0V Bias Supply·100% On-Wafer, DC and Output Power Testing·100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Voltage (Vee1,2,3) -6.0 VDC Supply Voltage (Vtune) +6.0 VDC Sup...

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SeekIC No. : 004467567 Detail

Q1001-BD: Features: ·On-Chip Resonator·+5.0 dBm Output Power·-97 dBc/Hz @ 100KHz Phase Noise·20mA @ -5.0V Bias Supply·100% On-Wafer, DC and Output Power Testing·100% Visual Inspection to MIL-STD-883 Method 20...

floor Price/Ceiling Price

Part Number:
Q1001-BD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

·On-Chip Resonator
·+5.0 dBm Output Power
·-97 dBc/Hz @ 100KHz Phase Noise
·20mA @ -5.0V Bias Supply
·100% On-Wafer, DC and Output Power Testing
·100% Visual Inspection to MIL-STD-883 Method 2010



Specifications

Supply Voltage (Vee1,2,3) -6.0 VDC
Supply Voltage (Vtune) +6.0 VDC
Supply Current (Iee1,2,3) 30 mA
Supply Current (Itune) 1 mA
Storage Temperature (Tstg) -65 to +165 OC
Operating Temperature (Ta) -55 to MTTF Table 1
Junction Temperature (Tch) MTTF Table 1


(1) Junction temperature affects a device's MTTF. It is recommended to keep channel temperature as low as possible for maximum life.




Description

Mimix Broadband's Q1001-BD 5.8-6.9 GHz GaAs HBT VCO is a fully integrated oscillator MMIC with on-chip tuning diode and resonator. This design is based on a cross coupled differential pair with on-chip buffer amplifier and output balun. The use of a high-Q resonator structure and integrated varactor diodes results in optimum phase-noise performance. This MMIC uses Mimix Broadband's 2 um GaAs HBT device model technology to ensure low flicker (1/f ) noise and high reliability. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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