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PXB4330E

Features: • Performance up to STM-4/OC-12 equivalent ATM layer processing • Flexibel throughput from1 .. 687 Mbit/s bi-directional• Up to 16384 connections in both directions (VPC/ VCC)• Temperature range from 0 to 70• Multiport UTOPIA Level 2 interface in up- and dow...

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PXB4330E: Features: • Performance up to STM-4/OC-12 equivalent ATM layer processing • Flexibel throughput from1 .. 687 Mbit/s bi-directional• Up to 16384 connections in both directions (VPC/...

PXB4330E Data Sheet

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Part Number:
PXB4330E
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• Performance up to STM-4/OC-12 equivalent ATM layer processing
• Flexibel throughput from1 .. 687 Mbit/s bi-directional
• Up to 16384 connections in both directions (VPC/ VCC)
• Temperature range from 0 to 70
• Multiport UTOPIA Level 2 interface in up- and downstream direction according to ATM Forum, UTOPIA Level 1 and 2 specifications [1,2]
• 16-bit microprocessor interface, e.g. 386EX
• Cell insert/extract function
• 32 cell FIFO buffer at UTOPIA upstream receive interface
• 96 cell shared buffer for up to 24 PHYs at UTOPIA downstream transmit interface
• Boundary scan support according to JTAG [4]
• Internal data stream loop at ATM and at PHY side


Pinout

Connection Diagram


Specifications

Parameter Symbol
Limit Values
Unit
Ambient temperature under biasPXB TA -40 to 85
Storage temperature Tstg -40 to 125
IC supply voltage with respect to ground VDD -0.3 to 3.6 V
Voltage on any pin with respect to ground VS -0.4 to VDD + 0.4 V
ESD robustness1) HBM: 1.5 k, 100 pF VESD,HBM 2500 V
1) According to MIL-Std 883D, method 3015.7 and ESD Association Standard EOS/ESD-5.1-1993.
The RF Pins 20, 21, 26, 29, 32, 33, 34 and 35 are not protected against voltage stress > 300 V (versus VS or
GND). The high frequency performance prohibits the use of adequate protective structures.


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