PSB/RSB

Features: SpecificationsDescription Snubber capacitor PSB/RSB for energy conversion and control in power semiconductor circuits, resonant circuits, protection circuits in SMPSs, induction heaters, high voltage, high current and high pulse applicationsWhatever position assuring correct heat dissipa...

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SeekIC No. : 004465741 Detail

PSB/RSB: Features: SpecificationsDescription Snubber capacitor PSB/RSB for energy conversion and control in power semiconductor circuits, resonant circuits, protection circuits in SMPSs, induction heaters, h...

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Part Number:
PSB/RSB
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/25

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Product Details

Description



Features:






Specifications






Description

      Snubber capacitor PSB/RSB for energy conversion and control in power semiconductor circuits, resonant circuits, protection circuits in SMPSs, induction heaters, high voltage, high current and high pulse applicationsWhatever position assuring correct heat dissipation. Arrangement of many components with box walls in contact not admitted; suggested minimum distance between side by side elements 1/8 of the box thickness (B size)
      PSB/RSB Tinned copper wire (lead-free). 2 x terminals (S=5±1mm, L=25± 5mm terminals length), 4 x terminals (SD=5,5±1,5mm) or 6 x terminals (ST=5,5±1,5mm) execution.Extended double side metallized carrier film with internal series connection and metallized film(refer to general technical information)
       PSB/RSB has 4 features, which includes High Current,High Voltage,Multiple Lead Styles,High Pulse.The Max.permissible ambient temperature comprise:PSB,+70,operation at rated power,current,voltage and  natural cooling(+85 observing voltage and current derating);RSB,+70 operation at rated power ,current,voltage and natural cooling.
      The long term stability(at 1 KHz) is capactiance variation ±1% after a period of 2 years at standard environmental conditions.Resistance to soldering heat test has two needs,one is Test conditions including Solder bath temperature=+260±5,Dipping time (with heat screen)=10±1s;the other is performance including capacitance change±1%,DF change 0.0010 at 1kHz,IR50% of initial limit value.The temperature derated voltage of PSB/RSB is for operating temperature(case)>+85,Ur must be decreased 1.5% for every exceeding +85,Urms must be decreased 2.5% for every exceeding +85.
      Interative refinement is needed for the conceptual architecture by adding some attributes listed in Table 1 or more connections of specific types between components. For instance, shared data structures, PSB/RSB, and etc. could be added to the  diagram. In addition, input/output queues can be inserted  for incoming/outgoing interfaces. For instance,  if simply based on requirements, PathMsg (C1) and ResvMsg (C3) may seem independent, since they are used in opposite directions in the protocol. But they are related through some attributes after further analysis. In fact, each will trigger the generation of the other message type when the message reaches the end router. The connection between C1 and C3 will then be added to the design. The iteration process will make the conceptual architecture more concrete.






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