PS21867-AP

Features:

Compact Packages
Single Power Supply
Integrated HVICs
Direct Connection to CPU


Application

Washing Machines
Refrigerators
Air Conditioners
Small Servo Motors
Small Motor Control


Specifications

Characteristics	Symbol	PS21867-AP	Units
Power Device Junction Temperature*	Tj	-20 to 125	°C
Module Case Operation Temperature (See Tf Measurement Point Illustration)	Tf	-20 to 100	°C
Storage Temperature	Tstg	-40 to 125	°C
Mounting Torque, M4 Mounting Screws	-	13	in-lb
Module Weight (Typical)	-	65	Grams
Self-protection Supply Voltage Limit (Short Circuit Protection Capability)**	VCC(prot.)	400	Volts
Isolation Voltage, AC 1 minute, 60Hz Sinusoidal, Connection Pins to Heatsink Plate	VISO	2500	Volts

*The maximum junction temperature rating of the power chips integrated within the DIP-IPM is 150°C (@T_f 100°C). However, to ensure safe operation of the DIP-IPM, the average junction temperature should be limited to T_j(avg) 125°C (@T_f 100°C).
**V_D = 13.5 ~ 16.5V, Inverter Part, T_f = 125°C, Non-repetitive, Less than 2s


Description

DIP-IPMs are intelligent power modules PS21867-AP that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 5th generation IGBTs, DIP packaging, and application specific HVICs allow the designer to reduce inverter size and overall design time.