Features: · Compact Packages· Single Power Supply· Integrated HVICs· Direct Connection to CPU· Optimized for 5kHz OperationApplication· Washing Machines· Refrigerators· Air Conditioners· Small Servo Motors· Small Motor ControlSpecifications Characteristics Symbol PS21445-E Units P...
PS21245-E: Features: · Compact Packages· Single Power Supply· Integrated HVICs· Direct Connection to CPU· Optimized for 5kHz OperationApplication· Washing Machines· Refrigerators· Air Conditioners· Small Servo...
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Characteristics |
Symbol |
PS21445-E |
Units |
Power Device Junction Temperature* Storage Temperature Heatsink Temperature (See Tf Measure Point Illustration) Mounting Torque, M3 Mounting Screws Module Weight (Typical) Heatsink Flatness Self-protection Supply Voltage Limit (Short Circuit Protection Capability)** Isolation Voltage, AC 1 minute, 60Hz Sinusoidal, Connection Pins to Heatsink Plate |
Tj Tstg Tf - - - VCC(prot.) VISO |
-20 to 150 -40 to 125 -20 to 100 13 54 -50 to 100 400 1500 |
°C °C °C in-lb Grams µm Volts Volts |
IGBT Inverter Sector | |||
Collector-Emitter Voltage Collector Current, ± (TC = 25°C) Peak Collector Current, ± (TC = 25°C, Instantaneous Value (Pulse)) Supply Voltage (Applied between P - N) Supply Voltage, Surge (Applied between P - N) Collector Dissipation (TC = 25°C, per 1 Chip) |
VCES IC ICP VCC VCC(surge) PC |
600 25 50 450 500 56 |
Volts Amperes Amperes Volts Volts Watts |
Control Sector | |||
Supply Voltage (Applied between VP1-VNC, VN1-VNC) Supply Voltage (Applied between VUFB-VUFS, VVFB-VVFS, VWFB-VWFS) Input Voltage (Applied between UP, VP, WP-VNC, UN, VN, WN-VNC) Fault Output Supply Voltage (Applied between FO-VNC) Fault Output Current (Sink Current at FO Terminal) Current Sensing Input Voltage (Applied between CIN-VNC) |
VD VDB VCIN VFO IFO VSC |
20 20 -0.5 ~ 5.5 -0.5 ~ VD+0.5 15 -0.5 ~ VD+0.5 |
Volts Volts Volts Volts mA Volts |
DIP and mini-DIP IPMs are intelligent power modules PS21245-E that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 4th generation IGBTs, DIP packaging, and application specific HVICs allow the designer to reduce inverter size and overall design time.