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PS21244-E

Features: · Compact Packages· Single Power Supply· Integrated HVICs· Direct Connection to CPU· Optimized for 5kHz OperationApplication·Washing Machines·Refrigerators·Air Conditioners·Small Servo Motors·Small Motor ControlSpecifications Characteristics Symbol PS21563 Units Power ...

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SeekIC No. : 004465433 Detail

PS21244-E: Features: · Compact Packages· Single Power Supply· Integrated HVICs· Direct Connection to CPU· Optimized for 5kHz OperationApplication·Washing Machines·Refrigerators·Air Conditioners·Small Servo Mot...

PS21244-E Data Sheet

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Part Number:
PS21244-E
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/21

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Product Details

Description



Features:

· Compact Packages
· Single Power Supply
· Integrated HVICs
· Direct Connection to CPU
· Optimized for 5kHz Operation


Application

·Washing Machines
·Refrigerators
·Air Conditioners
·Small Servo Motors
·Small Motor Control


Specifications

Characteristics
Symbol
PS21563
Units
Power Device Junction Temperature*
Tj
-20 to 150
Storage Temperature
Tstg
-40 to 125
Case Operating Temperature (See TC Measure Point Illustration)
TC
-20 to 100
Mounting Torque, M4 Mounting Screws
-
13
in-lb
Module Weight (Typical)
-
54
Grams
Heatsink Flatness
-
-50 to 100
µm
Self-protection Supply Voltage Limit (Short Circuit Protection Capability)**
VCC(prot.)
400
Volts
Isolation Voltage, AC 1 minute, 60Hz Sinusoidal, Connection Pins to Heatsink Plate
VISO
1500
Volts
*The maximum junction temperature rating of the power chips integrated within the DIP-IPM is 150  (@TC
  100 ). However, to ensure safe operation of the DIP-IPM,the average junction temperature should be limited
   to Tj(avg) 125  (@TC 100 ).
**VD = VDB = 13.5 ~ 16.5V, Inverter Part, Tj = 125 , Non-repetitive, Less than 2µs


Description

DIP and mini-DIP IPMs are intelligent power modules PS21244-E that integrate power devices, drivers, and protection circuitry in an ultra compact dual-in-line transfer-mold package for use in driving small three phase motors. Use of 4th generation IGBTs, DIP packaging, and application specific HVICs allow the designer to reduce inverter size and overall design time.




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