PR2100L

Features:

·Surface mountable
·High temperature operation
·Closely matched emissions
·Matched to OPR2100 Photodiode Array


Specifications

Re verse Volt age. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0 V
Continous For ward Cur rent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Peak For ward Cur rent (1 A pulse width, 300 pps) . . . . . . . . . . . . . . . . . . . . . . . 1.0 A
Storage and Op erating Tem perature . . . . . . . . . . . . . . . . . . . . . . . . . .-55 to +125
Power Dis sipation (der ate @ 1.00 mW/ above 25) . . . . . . . . . . . . . . . . . . 100 mW


Description

Enclosed in a compact polyimide chip carrier, this six element LED has been specifically designed to be used as an illuminating source for the OPR2100L.

The light is spectrally matched to the responsivity for maximum efficency. The six chips are bonded with common cathodes and individual anodes to allow channel matching. The package can withstand multiple exposures to the most demanding solder conditions. The wrap around solder pads are gold plated for exceptional storage and wetting characteristics of PR2100L.