Features: · Rugged polysilicon gate cell structure· high current handling capability, latch-proof· Hermetically sealed package· Low package inductance· Very low thermal resistance· Reverse polarity available upon request: PPNH(G)Z52F120B· high frequency IGBT, low switching losses· anti-parallel FR...
PPNGZ52F120A: Features: · Rugged polysilicon gate cell structure· high current handling capability, latch-proof· Hermetically sealed package· Low package inductance· Very low thermal resistance· Reverse polarity ...
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DESCRIPTION |
SYMBOL |
MAX. |
UNIT |
Collector-to-Emitter Breakdown Voltage (Gate Shorted to Emitter) @ TJ 25°C |
BVCES |
1200 |
Volts |
Collector-to-Gate Breakdown Voltage @ TJ 25°C, RGS= 1 M |
BVCGR |
1200 |
Volts |
Continuous Gate-to-Emitter Voltage |
VGES |
+/-20 |
Volts |
Transient Gate-to-Emitter Voltage |
VGEM |
+/-30 |
Volts |
Continuous Collector Current |
IC25 |
52 33 |
Amps |
Peak Collector Current (pulse width limited by Tjmax,) Tj= 25°C Tj= 90°C |
ICM(25) ICM(90) |
104 66 |
Amps |
Avalanche energy (single pulse) @ IC= 25A, VCC= 50V, L= 200H, RG= 25, Tj= 25°C |
EAS |
65 |
mJ |
Short circuit current (SOA) , VCE1200V, TJ= 150°C, tsc10s |
IC(SC) |
260 |
A |
Short circuit (reverse) current (RBSOA) , VCE1200V, TJ= 150°C |
IC(SC)RBSOA |
66 |
A |
Power Dissipation |
PD |
300 |
Watts |
Junction Temperature Range |
Tj |
-55 to +150 |
°C |
Storage Temperature Range |
Tstg |
-55 to +150 |
°C |
Continuous Source Current (Body Diode, PPNHZ52F120A only) |
IS |
50 |
Amps |
Pulse Source Current (Body Diode, PPNHZ52F120A only) |
ISM |
100 |
Amps |
Thermal Resistance, Junction to Case |
JC |
0.42 |
°C/W |