Features: • 'Trench' technology• Very low on-state resistance• Fast switching• Low thermal resistance• Logic level compatibleApplication• High frequency computer motherboard d.c. to d.c. converters• High current switchingPinoutSpecifications SYMBOL ...
PHD55N04LT: Features: • 'Trench' technology• Very low on-state resistance• Fast switching• Low thermal resistance• Logic level compatibleApplication• High frequency computer ...
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Features: • 'Trench' technology• Very low on-state resistance• Fast switching...
Features: • 'Trench' technology• Very low on-state resistance• Fast switching...
Features: • 'Trench' technology• Very low on-state resistance• Fast switching...
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MIN. |
UNIT |
VDS |
Repetitive peak drain-source voltage |
Tj = 25 °C to 150°C |
- |
35 |
V |
VDGR |
Drain-gate voltage |
Tj = 25 °C to 175°C;RGS = 20 k |
- |
35 |
V |
VGS |
Gate-source voltage |
- |
±15 |
V | |
VGSM |
Gate-source voltage (pulse peak value) |
Tj 150°C |
- |
±20 |
V |
ID
|
Drain current (DC) |
Tmb = 25 °C |
- |
55 |
A |
Tmb = 100 °C |
- |
38 |
A | ||
IDM
|
Drain current per MOSFET (pulse peak value) |
Tmb = 25 °C |
- |
220 |
A |
Ptot |
Total power dissipation |
Tmb = 25 °C |
- |
103 |
W |
Tstg,Tj |
Storage & operating temperature |
-55 |
175 |
°C |
PHD55N04LT N-channel enhancement mode logic level field-effect power transistor in a plastic envelope using 'trench' technology.