Features: SpecificationsDescriptionThe AMI PEEL173 is a CMOS programmable electrically erasable logic device that provides a high-performance, low-power,reprogrammable,and architecturally enhanced alternative to convertional FRLAs. Designed in advanced CMOS EEPROM techonology, the PEEL173 rivals s...
PEEL173: Features: SpecificationsDescriptionThe AMI PEEL173 is a CMOS programmable electrically erasable logic device that provides a high-performance, low-power,reprogrammable,and architecturally enhanced a...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Features: · Ultra Low Power Operation- VCC = 5 Volts ±10%- Icc = 10 µA (typical) at standby-...
Features: High Speed/Low Power- Speeds ranging from 7ns to 25ns- Power as low as 30mA at 25MHzElec...
The AMI PEEL173 is a CMOS programmable electrically erasable logic device that provides a high-performance, low-power,reprogrammable,and architecturally enhanced alternative to convertional FRLAs. Designed in advanced CMOS EEPROM techonology, the PEEL173 rivals speed parameters of comparable bipolar PLDs while providing a dramatic improvement in active powerconsumption. The EE reprogrammability of the PEEL173 reduces development and field retrofit costs and enchances testbility to ensure 100% field programmability and funtion. PEEL techonology allows for low cost "windowless"packaging in a ceramic or plastic 24-pin,300-mil DIP.The PEEL173 provides both a programmable AND array and a programmable OR array to offer drop-in compatibility with the bipolar PLS173.Applications for the device cover a wide range of combinational functions, such as:replacement of random SSI/MSI logic circuitry,priority encodes, comparators, parity generators, code coverters, address decoders, and multiplexers. The PEEL173 is supported by popular development tools and programmers from third-party manufactures and by AMI's PEEL devepoment system and APEEL logic assembler.
PEEL173 has many unique features: The first one is FRLA architecture. The second one is droip-in replacement for PLS173. The third one is application versatility. The forth one is advanced CMOS EEPROM technology.The fifth one is low power consumption. The sixth one is high performance. The seventh one is EE reprogrammability.The last one is development support.
Well, this is a simple introduction to this type of product, if you want to know more about PEEL173, please pay more attention to our web. Thanks for your attention!