PEB20324

Features: Four independent 24/32-channel HDLC PCM Controllers with common PCI interface. ach of them provides:• Dedicated 1024 byte Tx Buffer• Dedicated 1024 byte Rx Buffer• Dedicated Serial PCM Interface Controller T1 rates: 1.536, 1.544, 3.088, 6.176 Mbit/s E1 rates: 2.048, 4.0...

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PEB20324 Picture
SeekIC No. : 004457965 Detail

PEB20324: Features: Four independent 24/32-channel HDLC PCM Controllers with common PCI interface. ach of them provides:• Dedicated 1024 byte Tx Buffer• Dedicated 1024 byte Rx Buffer• Dedica...

floor Price/Ceiling Price

Part Number:
PEB20324
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/25

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Product Details

Description



Features:

Four independent 24/32-channel HDLC PCM Controllers with common PCI interface. ach of them provides:
• Dedicated 1024 byte Tx Buffer
• Dedicated 1024 byte Rx Buffer
• Dedicated Serial PCM Interface Controller
T1 rates: 1.536, 1.544, 3.088, 6.176 Mbit/s
E1 rates: 2.048, 4.096, 8.192 Mbit/s
• Dedicated 64-channel DMA Controller
Supports linked-list buffer processing
16-DWord Tx DMA FIFO
16-DWord Rx DMA FIFO
4-DWord burst of Rx descriptors
3-DWord burst of Tx descriptors
n-DWord burst of configuration blocks n is unlimited according the MUNICH128X, but internal port arbitration may lead to lower typical burst size of 4 or 8 DWords)
• Dynamic Programmable Channel Allocation
Compatible with T1/DS1 24-channel and CEPT 32-channel PCM byte format
Concatenation of any, not necessarily consecutive, time slots to superchannels
independently for receive and transmit direction
Support of H0, H11, H12 ISDN-channels
Subchanneling on each time slot possible
• Bit Processor Functions (adjustable for each channel)
HDLC Protocol
Automatic flag detection
Shared opening and closing flag
Detection of interframe-time-fill change, generation of
interframe-time-fill '1's or flags
Zero bit insertion
Flag stuffing and flag adjustment for rate adaption
CRC generation and checking (16 or 32 bits)
Transparent CRC option per channel and/or per message
Error detection (abort, long frame, CRC error, 2 categories
of short frames, non-octet frame content)
ABORT/IDLE flag generation
V.110/X.30 Protocol
Automatic synchronization in receive direction, automatic generation of
the synchronization pattern in transmit direction
E/S/X bits freely programmable in transmit direction, may be changed
during transmission; changes monitored and reported in receive direction
Generation/detection of loss of synchronism
Bit framing with network data rates from 600 bit/s up to 38.4 Kbit/s
Transparent Mode A
Slot synchronous transparent transmission/reception without frame structure
Flag generation, flag stuffing, flag extraction, flag generation
in the abort case with programmable flag
Synchronized data transfer for fractional T1/PRI channels
Transparent Mode B
Transparent transmission/reception in frames delimited by 00H flags
Shared opening and closing flag
Flag stuffing, flag detection, flag generation in the abort case
Error detection (non octet frame content, short frame, long frame)
Transparent Mode R
Transparent transmission/reception with GSM 08.60 frame structure
Automatic 0000H flag generation/detection
Support of 40, 391/2, 401/2 octet frames
Error detection (non octet frame contents, short frame, long frame)
Protocol Independent
Channel inversion (data, flags, IDLE code)
Format conventions as in CCITT Q.921 § 2.8
Data over- and underflow detected
• 32 Bit / 33 MHz PCI 2.1 Interface
• 32 Bit / 33 MHz De-multiplexed Bus Interface Option
• 0.5 mm, 3.3 V-Optimized Technology
• 3.3 V I/O Capability with 5.0 V Input Tolerance
• 160-pin MQFP Package



Pinout

  Connection Diagram




Specifications

Parameter
Symbol
Limit Values
Unit
min.
max.
Ambient temperature under bias: PEB
PEF
TA
TA
0
40
70
85
°C
Junction temperature under bias
TJ
125
°C
Storage temperature
Tstg
65
125
°C
Voltage at any pin with respect to ground
VS
0.4
VDD + 0.4
V
ESD robustness1)
HBM: 1.5 kW, 100 pF
VESD,HBM
0.4
1000
V
1) According to MIL-Std 883D, method 3015.7 and ESD Ass. Standard EOS/ESD-5.1-1993.
The RF Pins 20, 21, 26, 29, 32, 33, 34 and 35 are not protected against voltage stress > 300 V (versus VS or
GND). The high frequency performance prohibits the use of adequate protective structures.
Note: Stresses above those listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.



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