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PBL401

Features: · High Case Dielectric Strength of 1500V· Low Forward Voltage Drop, High Current Capability· Surge Overload Rating to 150A Peak· Ideal for Printed Circuit Board Application· Plastic Material - UL Flammability Classification 94V-0· UL Listed Under Recognized Component Index, File Number E...

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SeekIC No. : 004455574 Detail

PBL401: Features: · High Case Dielectric Strength of 1500V· Low Forward Voltage Drop, High Current Capability· Surge Overload Rating to 150A Peak· Ideal for Printed Circuit Board Application· Plastic Materi...

PBL401 Data Sheet

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Part Number:
PBL401
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/25

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Product Details

Description



Features:

· High Case Dielectric Strength of 1500V
· Low Forward Voltage Drop, High Current Capability
· Surge Overload Rating to 150A Peak
· Ideal for Printed Circuit Board Application
· Plastic Material - UL Flammability Classification 94V-0
· UL Listed Under Recognized Component Index, File Number E95060


Application

· Case: Molded Plastic
· Terminals: Plated Leads, Solderable per MIL-STD-202, Method 208
· Polarity: Symbols Marked on Case
· Approx. Weight: 5.6 grams
· Marking: Type Number


Specifications

Characteristic Symbol PBL
401		 PBL
402		 PBL
403		 PBL
404		 PBL
405		 PBL
406		 PBL
407		 Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage		 VRRM
VRWM
VR		 50 100 200 400 600 800 1000 V
RMS Reverse Voltage VR(RMS) 35 70 140 280 420 560 700 V
Average Rectified Output Current @ TC = 100°C IO 4.0 A
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave superimposed on rated load
(JEDEC Method)		 IFSM 150 A
Forward Voltage (per element) @ IF = 5.0A VFM 1.1 V
Peak Reverse Current @ TC = 25°C
at Rated DC Blocking Voltage @ TC = 125°C		 IRM 10
1.0		 µA
mA
I2t Rating for Fusing (Note 2) I2t 166 A2s
Typical Thermal Resistance Junction to Case (Note 1) RJC 19 °C/W
Operating and Storage Temperature Range Tj, TSTG -65 to +125 °C
Notes: 1. Thermal resistance rom junction to case per element mounted on PC board with 13 x 13 x 0.03mm land areas.
            2. Non-repetitive for t > 1ms and < 8.3ms.


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