PAC560GTL

Features: ·24 terminations in a single package·5 chip solution for all 119 GTL terminations·High speed termination network·Center ground pin placement reduces ground bounce and eases board layout·Very low cross-talk·Saves board space and reduces assembly costApplication·High Performance Servers·Hi...

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SeekIC No. : 004453902 Detail

PAC560GTL: Features: ·24 terminations in a single package·5 chip solution for all 119 GTL terminations·High speed termination network·Center ground pin placement reduces ground bounce and eases board layout·Ve...

floor Price/Ceiling Price

Part Number:
PAC560GTL
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/25

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Product Details

Description



Features:

·24 terminations in a single package
·5 chip solution for all 119 GTL terminations
·High speed termination network
·Center ground pin placement reduces ground bounce and eases board layout
·Very low cross-talk
·Saves board space and reduces assembly cost



Application

·High Performance Servers
·High Performance Desk Top Systems
·Intel Celeron? and Pentium? CPUs



Description

High speed microprocessors  PAC560GTL demand unique, high speed bus termination.  The PACGTL Termination Network PAC560GTL provides 24 terminations per package and meets the requirements for high speed terminations.The termination resistor values are 56 or 120 ohms each.  Five devices provide the necessary terminations for the 32-bit address bus, 64-bit data bus, and the control of status signals.  Potential board layout solutions are included in this datasheet.

PAC560GTL provides high performance, high reliability, and low cost through manufacturing efficiency.  The termination resistor elements of PAC560GTL are fabricated using state-of-the-art thin film manufacturing.This integrated solution of PAC560GTL is silicon-based and has the same reliability characteristics of today!s microprocesso products.  The thin film resistors have very high stability over temperature, over applied voltage, and over life.  In addition, the QSOP (SSOP) industry standard packag- ing is easy to handle in manufacturing and yields high reliability similar to other semiconductor components.




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