Features: ·Minimal Ground Bounce, Cross-Talk·Stable 1% Absolute Tolerance elements·6 terminating lines per QSOP package·Save board space and reduces assembly cost·Minature 16-pin QSOP packageApplication·High speed server and workstation terminations (DDR, SSTL, and NTL)DescriptionHigh speed logic ...
PAC002SPFQ: Features: ·Minimal Ground Bounce, Cross-Talk·Stable 1% Absolute Tolerance elements·6 terminating lines per QSOP package·Save board space and reduces assembly cost·Minature 16-pin QSOP packageApplica...
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Features: · Minimal ground bounce, crosstalk· Stable 1% absolute tolerance elements· 16 terminatin...
US $.36 - .4 / Piece
Wirewound Resistors - Through Hole 1watt 50ohms 1% 100ppm
High speed logic devices such as NTL demand unique, high speed bus terminations. The Series/Parallel Termination Network provides 6 terminating channels per package and optimizes signal integrity by reducing reflections and ringing. The termination of PAC002SPFQ is in standard values shown below and is ideal for use in NTL buses. PAC002SPFQ features a flow through design for the series te minations. Ground-bounce and cross-talk are mini- mized using a proprietary die design which includes multiple die to package connections to the termination voltage. In addition, PAC002SPFQ are trimmed to a tight absolute tolerance of 1%, which provides tight imped- ance-matching and results in greatly reduced reflections.
The Series/Parallel Termination Network PAC002SPFQ provides high performance, superior reliability, and low cost through manufacturing efficiency. The termination resistor elements are fabricated using state-of-the-art thin film manufacturing technology, well known for PAC002SPFQ ability to achieve tight tolerances and precision matching. This integrated solution of PAC002SPFQ is silicon-based and has the same reliability characteristics as any of today!s microproces sor products. The thin film resistors have very excellent stability over temperature, applied voltage, and life. In addition, the QSOP PAC002SPFQ industry standard packaging is easy to handle in manufacturing, and enjoys the same high yields as typical semiconductor products.