PAC002SPFQ

Features: ·Minimal Ground Bounce, Cross-Talk·Stable 1% Absolute Tolerance elements·6 terminating lines per QSOP package·Save board space and reduces assembly cost·Minature 16-pin QSOP packageApplication·High speed server and workstation terminations (DDR, SSTL, and NTL)DescriptionHigh speed logic ...

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SeekIC No. : 004453894 Detail

PAC002SPFQ: Features: ·Minimal Ground Bounce, Cross-Talk·Stable 1% Absolute Tolerance elements·6 terminating lines per QSOP package·Save board space and reduces assembly cost·Minature 16-pin QSOP packageApplica...

floor Price/Ceiling Price

Part Number:
PAC002SPFQ
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/13

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Product Details

Description



Features:

·Minimal Ground Bounce, Cross-Talk
·Stable 1% Absolute Tolerance elements
·6 terminating lines per QSOP package
·Save board space and reduces assembly cost
·Minature 16-pin QSOP package



Application

·High speed server and workstation terminations (DDR, SSTL, and NTL)


Description

High speed logic devices such as NTL demand unique, high speed bus terminations. The Series/Parallel Termination Network provides 6 terminating channels per package and optimizes signal integrity by reducing reflections and ringing. The termination of PAC002SPFQ is in standard values shown below and is ideal for use in NTL buses. PAC002SPFQ features a flow through design for the series te minations. Ground-bounce and cross-talk are mini- mized using a proprietary die design which includes multiple die to package connections to the termination  voltage. In addition, PAC002SPFQ are trimmed to a tight absolute tolerance of 1%, which provides tight imped- ance-matching and results in greatly reduced reflections.

The Series/Parallel Termination Network PAC002SPFQ provides high performance, superior reliability, and low cost through manufacturing efficiency. The termination resistor elements are fabricated using state-of-the-art thin film manufacturing technology, well known for PAC002SPFQ ability to achieve tight tolerances and precision matching. This integrated solution of PAC002SPFQ is silicon-based and has the same reliability characteristics as any of today!s microproces sor products. The thin film resistors have very excellent stability over temperature, applied voltage, and life. In addition, the QSOP PAC002SPFQ industry standard packaging is easy to handle in manufacturing, and enjoys the same high yields as typical semiconductor products.




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