PinoutSpecificationsOutput Current MAX (A)Supply Voltage MAX (V)Slew Rate TYP (V/s)Standby Current MAX (mA)Power Dissipation MAX (W)1.5?(x2)401.41019?/ 28DescriptionThe amplifier design consists of dual power op amp on a single monolithic die. Side B of the dual monolithic is configured as a unity...
PA75: PinoutSpecificationsOutput Current MAX (A)Supply Voltage MAX (V)Slew Rate TYP (V/s)Standby Current MAX (mA)Power Dissipation MAX (W)1.5?(x2)401.41019?/ 28DescriptionThe amplifier design consists of ...
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Output Current MAX (A) | Supply Voltage MAX (V) | Slew Rate TYP (V/s) | Standby Current MAX (mA) | Power Dissipation MAX (W) |
---|---|---|---|---|
1.5?(x2) | 40 | 1.4 | 10 | 19?/ 28 |
The amplifier design consists of dual power op amp on a single monolithic die. Side B of the dual monolithic is configured as a unity gain buffer to increase the current capability of the master side A. The use of two PA75 amplifiers provides a cost-effective solution to applications where multiple amplifiers are required or a bridge configuration is needed. Very low harmonic distortion of .02% THD and low IQ makes the PA75 a good solution for power audio applications.
The PA75 is available in three standard package designs. The surface mount version of the PA75, the PA75CC, is an industry standard non-hermetic plastic 7-pin DDPAK. The through hole version of the PA75, the PA75CD and PA75CX, are industry standard non-hermetic plastic 7-pin TO-220 packages. The PA75CX is staggered lead formed and offers standard 100 mil spacing. This allows for easier PC board layout. (Please refer to the CX lead form package drawing for dimension of the PA75CX).
The monolithic amplifier is directly attached to the metal tabs of the PA75CC, PA75CD, and PA75CX. The metal tabs of the packages are directly tied to -Vs.
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