PA2423L-R

The PA2423L-R evaluation kit provides an easy to use, self-contained system for evaluating the RF performance and DC parameters of the PA2423L-R amplifier.

The PA2423L-R evaluation board requires minimal board area and components and in addition, it has been designed to allow the PA2423L-R to meet the Bluetooth tm Class 1 wireless technology specifications, with particular attention to gain and output power.Each evaluation kit contains:(1)pre-assembled evaluation board with input & output matching networks. Standard SMA connectors for interconnection to test equipment.(2)a test report of the delivered board.(3)a PA2423L-R datasheet.(3)a PA2423L-EK1 data sheet.The PA2423L-R has six features.(1)easy evaluation of the PA2423L Power Amplifier.(2)low Cost Design 8 components required.(3)minimum board space required 340 mils x 220mils.(4)high Output Power 22.5 dBm.(5)schematic and layout ready for production builds.(6)lead free 6 pin QFN Package.

The following components of PA2423L-R are used in the design of the PA2423L-EK1 evaluation board. As a reference, potential suppliers of these components are provided. SiGe Semiconductor does not endorse any specific vendor. In most cases, similar components from other suppliers of PA2423L-R will provide satisfactory performance.The minimum required components, as defined inside the heavy black box in the schematic (Figure 2), are designated as 'required components'. These components of PA2423L-R are detailed in Table 2. Please note, that all components are dual sourced. Table 3 identifies an alternate supplier for the components.Care should be taken to avoid routing the RF output track next to Vcc1 as this provides feedback around the output stage resulting in a loss in performance. The exposed pad of PA2423L-R at the bottom of the package is the ground connection for the IC. The ground vias should be placed as close as possible to this pad. All VCC lines should be well decoupled keeping the ground end of the decoupling capacitors as short as possible. The decoupling should avoid a ground return loop to the IC ground.