P1028-BD

Features: ·Excellent Saturated Output Stage·Balanced Design Provides Good Input/Output Match·14.0 dB Small Signal Gain·+29 dBm P1dB Compression Point·100% On-Wafer RF, DC and Output Power Testing·100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Voltage (Vd) +6.0 VDC ...

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SeekIC No. : 004438977 Detail

P1028-BD: Features: ·Excellent Saturated Output Stage·Balanced Design Provides Good Input/Output Match·14.0 dB Small Signal Gain·+29 dBm P1dB Compression Point·100% On-Wafer RF, DC and Output Power Testing·10...

floor Price/Ceiling Price

Part Number:
P1028-BD
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/25

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Product Details

Description



Features:

·Excellent Saturated Output Stage
·Balanced Design Provides Good Input/Output Match
·14.0 dB Small Signal Gain
·+29 dBm P1dB Compression Point
·100% On-Wafer RF, DC and Output Power Testing
·100% Visual Inspection to MIL-STD-883 Method 2010



Specifications

Supply Voltage (Vd)
+6.0 VDC
Supply Current (Id)
2360 mA
Gate Bias Voltage (Vg)
+0.3 VDC
Input Power (Pin)
+23 dBm
Storage Temperature (Tstg)
-65 to +165
Operating Temperature (Ta)
-55 to MTTF Table1
Channel Temperature (Tch)
MTTF Table1
(1) Channel temperature affects a device's MTTF. It is recommended to keep channel temperature as low 
     as possible for maximum life.




Description

Mimix Broadband's three stage balanced 43.5 - 46.5 GHz GaAs MMIC power amplifier has a small signal gain of 14.0 dB with a +29.0 dBm P1dB outputcompression point. The P1028-BD also includes Lange couplers to achieve good input and output return loss. This P1028-BD MMIC uses Mimix Broadband's 0.15 µm GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The P1028-BD chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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